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Wedge Bonder Product List

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Fully Automatic Thick Wire Bonder 'BJ955/959'

Fully Automatic Thick Wire Bonder 'BJ955/959'

A controllable current transducer and frequency that continuously monitors wire deformation.

The "BJ955/959" is a fully automatic thick wire wedge bonder developed for various substrates, chips, lead frames, and other products. It is possible to build a system for fully automatic or manual operation. We offer bond heads that can handle a wide range of wire sizes from 50um to 600um. 【Features (partial)】 ■ Bond head: Compatible with 50um - 600um aluminum, copper, and aluminum-copper clad ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized image recognition: Imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ High-precision programmable bond force actuator *For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment
  • Wedge Bonder

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Aluminum wire/ribbon wire compatible wedge bonder PowerFusion

Aluminum wire/ribbon wire compatible wedge bonder PowerFusion

Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.

Introducing the PowerFusion wedge bonder manufactured by K&S, handled by Techno Alpha. PowerFusion is a fully automatic wedge bonder for lead frame package devices, featuring the latest beltless direct drive motion system and a high-performance image recognition system, significantly improving productivity (UPH) and reliability compared to conventional models. Additionally, it offers a bond head configuration ranging from a single head type to a maximum of six heads, allowing for high productivity tailored to application needs and enabling line changes as necessary. 【Features】 <Productivity> - UPH increase: Adoption of direct drive servo system and high-speed image recognition system - MTBA increase: Enhanced uptime due to high-performance image recognition system <Performance> - Customizable loop profile - Improved bond position repeatability - Reduced damage to lead frames through the use of an input kicker with adjustable overload settings <Advanced Package Compatibility> - Support for small power devices - Expanded bond area - Improved indexing accuracy

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  • Other semiconductor manufacturing equipment
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BJ931 High-Speed Fully Automatic Wedge Bonder with Lead Frame Transport

BJ931 High-Speed Fully Automatic Wedge Bonder with Lead Frame Transport

Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.

The high-speed fully automatic dual-head wedge bonder Bondjet BJ931 meets the latest technologies and various demands for automotive products and power semiconductors. It supports aluminum wire, copper wire, gold wire, and ribbon, and the bond head can be replaced in just a few minutes. With a robust and clean design, the industry's largest bonding area, long maintenance intervals, user-friendly software, and support features, the Bondjet BJ931 can also be equipped with Hesse Mechatronics' industry-leading process monitoring system PiQC.

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Laser Sonic Copper Wire Wedge Bonder

Laser Sonic Copper Wire Wedge Bonder

An innovative technology that heats the bond, making it easier to wedge bond copper wire.

Fully automatic wedge bonder equipped with a heating function. It supplies laser energy to the tool tip via a beam trap. By using a laser-heated bond tool for ultrasonic wire bonding, it improves joint quality. Localized heating occurs simultaneously with cooling, preventing oxidation of the surrounding area. Heating allows bonding with lower load and lower power, enabling wedge bonding of copper wire to chips with thinner pad thickness. Improved bond quality can also enhance yield.

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Fully Automatic Thick Wire Wedge Bonder for Automotive Powertrains

Fully Automatic Thick Wire Wedge Bonder for Automotive Powertrains

Achieving high-quality bonds optimized for automotive powertrains.

In the automotive powertrain field, the bonding of components that require high reliability and durability is essential. Particularly in onboard applications and battery modules used in harsh environments, reliable and stable bonding directly impacts the maintenance of product performance. Inadequate bonding can lead to component failures, performance degradation, and even issues related to the overall reliability of the vehicle. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 have been developed to meet these demands. 【Application Scenarios】 - Wiring bonding for onboard applications - Busbar connections within battery modules - Lead frame connections in power modules 【Benefits of Implementation】 - Improved product lifespan through reliable bonding - Enhanced overall vehicle reliability through stable performance maintenance - Increased production efficiency through automation

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Fully Automatic Thick Line Wedge Bonder for Aerospace Applications

Fully Automatic Thick Line Wedge Bonder for Aerospace Applications

The optimal bonding solution for the aerospace field, which requires high reliability.

In the aerospace field, reliable and stable bonding technology is essential for the manufacturing of components that require extremely high reliability. In particular, products that must withstand harsh environments demand precise bonding where even minute defects are unacceptable. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 provide advanced bonding solutions to meet these stringent requirements. 【Application Scenarios】 - Manufacturing of electronic devices for aircraft - Joining of components for space equipment - Assembly of sensors that require high reliability 【Benefits of Implementation】 - Improved reliability of joints - Stabilization of the manufacturing process - Strengthening of quality control

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Fully Automatic Thick Wire Wedge Bonder for Power Electronics

Fully Automatic Thick Wire Wedge Bonder for Power Electronics

Providing optimal and high-quality bonds that correspond to high currents.

In the field of power electronics, reliable bonding is required to safely and efficiently transmit high currents. Particularly in applications that demand high output, such as EV battery modules and power modules, secure bonding using thick wires or ribbons is essential. Insufficient bonding can lead to heat generation, performance degradation, and even failure. Our fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 address these challenges and achieve stable bonding. 【Application Scenarios】 - EV/HEV battery modules - Power modules - Inverters - Motors 【Benefits of Implementation】 - Reliable bonding that accommodates high currents - Maintenance of product performance and increased longevity - Improved production efficiency

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Fully Automatic Thick Wire Wedge Bonder for LED Lighting

Fully Automatic Thick Wire Wedge Bonder for LED Lighting

Providing the optimal bond for high-brightness LED manufacturing.

In the manufacturing of high-brightness LED lighting, reliable electrical connections are directly linked to product performance. In particular, for thick wire bonding that handles large currents, secure bonding is essential, as it affects the brightness and lifespan of the LED. Inadequate bonding can lead to heat generation and performance degradation. Our fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 accommodate a wide range of wire sizes and achieve stable bonding, contributing to the maintenance of high-brightness LED quality. 【Application Scenarios】 - Connection of high-brightness LED chips to lead frames - Manufacturing of LED modules for large current applications - Mass production lines for LED lighting products 【Benefits of Implementation】 - Reduced risk of LED brightness degradation - Improved product reliability - Enhanced production efficiency

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Fully Automatic Thick Wire Wedge Bonder for Renewable Energy

Fully Automatic Thick Wire Wedge Bonder for Renewable Energy

Providing bonds that contribute to improving durability in the renewable energy sector.

In the field of renewable energy, long-term reliability and durability under harsh conditions are required. Particularly in components such as solar power generation panels and battery storage systems, secure and robust bonding is essential for maintaining product performance and longevity. Improper bonding can lead to performance degradation and early failure, potentially increasing maintenance costs. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 address these challenges and achieve reliable bonding. 【Application Scenarios】 - Connections in solar power generation panels - Internal wiring of battery modules - Component bonding in power conditioners 【Benefits of Implementation】 - Improved long-term reliability of products - Maintenance of performance under harsh conditions - Reduction in maintenance costs

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Wedge Bonder BJ955/BJ959/BJ985 for Sensors

Wedge Bonder BJ955/BJ959/BJ985 for Sensors

Providing the ideal bond for manufacturing high-sensitivity sensors.

In the manufacturing of high-sensitivity sensors, precise bonding is required to accurately capture fine signals. Particularly, to maximize the performance of the sensor, it is crucial to eliminate minute misalignments and contact failures in wire bonding as much as possible. Improper bonding can lead to increased noise and signal attenuation, potentially resulting in decreased sensitivity of the sensor. Our fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 achieve reliable bonding necessary for the production of high-sensitivity sensors through high-precision image recognition and stable bonding force. 【Application Scenarios】 - Manufacturing line for high-sensitivity sensors - Bonding of electronic components requiring fine signal transmission - Product development where quality stability is important 【Benefits of Implementation】 - Reduced risk of sensor sensitivity decline - Improved product reliability - Achieving stable productivity

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Laser Sonic Copper Wire Wedge Bonder for Semiconductor Manufacturing

Laser Sonic Copper Wire Wedge Bonder for Semiconductor Manufacturing

Easily connect copper wire chips with innovative laser heating.

In chip connections for semiconductor manufacturing, the trend towards miniaturization and higher density has led to a demand for bonding to chips with thinner pad thicknesses. Particularly when using copper wire, traditional bonding methods require high loads and power, which pose risks of damage to the chip and reduced yield. Our laser sonic copper wire wedge bonder is equipped with a heating function that supplies laser energy to the tip of the bond tool, making it easier to achieve wedge bonding with copper wire. The laser heating improves bondability, enabling bonding at lower loads and power, which contributes to the application on chips with thin pad thicknesses and enhances bond quality, thereby improving yield. 【Application Scenarios】 - Copper wire bonding to chips with thin pad thicknesses - Semiconductor devices requiring high-density packaging - Manufacturing lines aiming to improve yield 【Benefits of Implementation】 - Reduced damage to chips through bonding at low loads and power - Improved bond quality due to enhanced bondability - Increased yield

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Laser Sonic Copper Wire Wedge Bonder for Automotive Parts

Laser Sonic Copper Wire Wedge Bonder for Automotive Parts

Easier wedge bonding of copper wire using heating technology.

In the automotive parts industry, reliable connections such as sensor wiring are required. In particular, the bonding of copper wire to chips with thin pad thickness requires high technology and precise control. Improper bonding can lead to decreased product performance and failures. Our Laser Sonic copper wire wedge bonder addresses these challenges with innovative heating technology. 【Application Scenarios】 - Wedge bonding of copper wire in sensor wiring - Bonding to chips with thin pad thickness - Improving reliability of automotive parts 【Benefits of Implementation】 - Improved bondability - Achieving bonds with low load and low power - Improved yield due to enhanced bond quality

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Fully Automatic Thick Wire Wedge Bonder for Medical Devices

Fully Automatic Thick Wire Wedge Bonder for Medical Devices

High-precision bonding solutions that meet miniaturization needs.

In the medical device industry, there is a demand for miniaturization of products and high reliability. In particular, the precise joining of fine components is essential for maintaining the performance and safety of the devices. Improper joining can lead to device failure or performance degradation. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 address these challenges and contribute to the miniaturization and high precision of medical devices. 【Application Scenarios】 - Circuit board assembly for small medical devices - Joining of fine components such as catheters and sensors - Manufacturing of implantable devices 【Benefits of Implementation】 - Support for miniaturization design of products - Improved reliability through high-precision bonding - Enhanced production efficiency

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Fully Automatic Thick Wire Wedge Bonder for Communication Equipment

Fully Automatic Thick Wire Wedge Bonder for Communication Equipment

Providing optimal and high-quality bonds that support high-speed transmission.

In the telecommunications equipment industry, reliable bonding technology is required to achieve high-speed and stable signal transmission. Particularly in components that handle high-frequency signals, the quality of fine connections directly affects communication speed and stability. Improper bonding can lead to signal attenuation and noise generation, potentially resulting in decreased communication performance. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 address these challenges and provide high-quality bonds. 【Application Scenarios】 - Manufacturing high-speed communication modules - Wiring for high-density mounted circuit boards - Bonding of RF components 【Benefits of Implementation】 - Improved high-speed transmission performance - Stabilization of signal quality - Enhanced product reliability

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Fully Automatic Thick Wire Wedge Bonder for Industrial Robots

Fully Automatic Thick Wire Wedge Bonder for Industrial Robots

Reliable bonding solutions that support the robustness of industrial robots.

In the field of industrial robots, stable operation in harsh environments and long-term reliability are required. In particular, strong bonding that can withstand vibrations and shocks is essential for the connections of robot arms and sensor components. Insufficient bonding can lead to malfunctions and failures, posing a risk of halting the entire production line. Our fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 have been developed to meet the stringent demands of industrial robots. They achieve reliable bonding to various substrates, chips, and lead frames, contributing to the robustness and reliability of robots. 【Application Scenarios】 - Sensor connections for industrial robot arms - Wiring for joints subjected to high loads - Mounting electronic components in environments with high vibrations and shocks 【Benefits of Implementation】 - Improved operational stability and reliability of robots - Reduced maintenance frequency and downtime - Long-term performance maintenance in harsh environments

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Fully automatic thick wire wedge bonder for home appliances BJ955 BJ959 BJ985

Fully automatic thick wire wedge bonder for home appliances BJ955 BJ959 BJ985

Bonding solutions that contribute to improving productivity and reducing costs in home appliance manufacturing.

In the home appliance industry, there is a growing demand for reliable and precise joining technologies due to the miniaturization and high performance of products. In particular, improving efficiency and reducing costs on production lines are critical challenges for maintaining competitiveness. Improper joining can lead to increased product defect rates and higher repair costs. The fully automatic thick wire wedge bonder BJ955/BJ959/BJ985 addresses these challenges and contributes to productivity improvement and cost reduction by achieving stable, high-quality bonding. 【Application Scenarios】 - PCB assembly for small home appliances - Component joining for high-functionality home appliances - Efficiency improvement through automation of production lines - Flexible production accommodating diverse materials 【Benefits of Implementation】 - Cost reduction through decreased defect rates - Shorter delivery times due to increased production speed - Reduced burden on operators and improved productivity - Strengthened capability to accommodate a wide range of product lineups

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Fully Automatic Thick Wire Wedge Bonder for Semiconductor Packages

Fully Automatic Thick Wire Wedge Bonder for Semiconductor Packages

Providing optimal and high-quality bonding that supports multi-pin configurations.

In the semiconductor packaging industry, as the trend towards multi-pin configurations progresses, there is a demand for high-density and highly reliable bonding. Particularly when connecting numerous leads or chips, precise positioning and stable joints are directly linked to the product's performance and durability. Improper bonding can lead to signal degradation or product failure. The fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 were developed to meet these needs. 【Application Scenarios】 - Manufacturing of semiconductor packages with increasing pin counts - Bonding of substrates for automotive applications - Connections to large substrates such as battery modules - Manufacturing of electronic components requiring high-density mounting 【Benefits of Implementation】 - Supports a wide range of wire sizes to meet the demands of multi-pin configurations - Accurate bonding through high-speed and high-precision image recognition - Reduced setup time due to automatic calibration features - Reliability backed by extensive track record in EV battery modules

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Fully Automatic Thick Wire Wedge Bonder for EV Batteries

Fully Automatic Thick Wire Wedge Bonder for EV Batteries

Providing optimal adhesive for large-capacity bonding for EV batteries.

In the EV battery industry, especially for products with increasing capacity, reliable electrical connections are essential. In battery modules, secure bonding using thick wires or ribbons to handle high currents is crucial for maintaining product performance and ensuring safety. Improper bonding can lead to heat generation, performance degradation, and even safety issues. The fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 have a proven track record for EV battery modules, achieving reliable bonding that accommodates increased capacity. 【Application Scenarios】 - Manufacturing of EV battery modules - Power devices requiring high currents - In-vehicle applications demanding high reliability 【Benefits of Implementation】 - Stable performance maintenance of large-capacity batteries - Improved efficiency through automation of the manufacturing process - Enhanced product reliability and ensured safety

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